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CsI:Tl Architecture

Tailored to fit — without compromise.


Deposition TechniqueDirect Deposition
CsI:Tl		Indirect Deposition
CsI:Tl
Lamination
Gadox(GOS)
ProcessCsI directly deposited on TFTCsI on substrate → bonded to TFTGadox sheet laminated
Image Quality★★★★★
★★★★☆
★★☆☆☆
FeatureHighest resolution,
Native bond to TFT		Cost-effective,
Excellent sensitivity		Cost-effective,
Excellent X-ray resistance


“Custom-built solutions, perfectly aligned with your goals”

Custom your options — without compromise.  

Customizable Options

Substrate

Hard / Flexible

Deposition Type

Direct / Indirect

CsI:Tl Thickness

180µm ~ 800µm

Sensor Type

TFT( a-Si / IGZO ), CMOS

Glass Type

Glass / Glass-Free

Size

Max. 500mm x 500mm

Direct Deposition

Confidence in clarity – Direct Deposition for superior quality across all platforms

TFT Typea-Si + GlassIGZO + Glassa-Si + Glass Free
ScintillatorCsI:Tl
CsI Thickness300µm500µm 300µm500µm300µm500µm
MTF(%) 2lp/mm403440344034
Sensitivity (lsb/uGy)125145135155125145
Light Out(%) @ Lanex sheet330%400%360%430%330%400%
Effective Dim.(Max.)430X430mm
SubstrateTFTTFTPolyimide

Indirect Deposition

Confidence in performance – Indirect for cost-effective, high-sensitivity imaging 

Sensor TypeTFT(a-Si / IGZO), CMOS
ScintillatorCsI:Tl
CsI Thickness300µm500µm
MTF(%) 2lp/mm4034
CTF(%) 3lp/mm
30%24%
Light Out(%) @ Lanex sheet330%400%
Effective Dim.(Max.)500X500mm
SubstrateAl

Customer Support

Feel free to reach out via phone or email 

— we'll guide you to the most effective solution.

Business Development

sales@abyzr.com

For orders

order@abyzr.com