FPGA
DENOISING
Conventional CsI Scintillators use glass-based TFT panels, which add weight and introduce vunerability to impact. Our non-glass technology offers two key advantages :
Experienced a cracked detector after a minor drop?
Without the rigidity and brittleness of glass, the panel is significantly less likely to crack under stress or accidental drops.
Dose your equipment fell too heavy?
Eliminating glass enables an exceptionally lightweight design— ideal for mobile and portable imaging applications.
A New Standard in Lightweight, Durable Imaging
Conducted on the Non-Glass CsI Panel to test structural durability under extreme bending.
Result: 100R Curvature Bend Test and Zero crack damage.
Made possible by Laser Lift-Off(LLO) Technology
At the heart of this innovation is our advanced Laser Lift-Off (LLO) process. This technique precisely separates the CsI layer from the glass substrate, allowing us to retain the performance of CsI while removing unnecessary weight and fragility.
The result? A scintillator that’s not only lighter and stronger—but also designed for the future of agile medical imaging.
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