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| Deposition Technique | Direct Deposition CsI:Tl | Indirect Deposition CsI:Tl | Lamination Gadox(GOS) | Hybrid Deposition CsI:Tl + GOS |
| Process | CsI directly deposited on TFT | CsI on substrate → bonded to TFT | Gadox sheet laminated | Special Processing Technology |
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| Feature | Highest resolution, Native bond to TFT | Cost-effective, Excellent sensitivity | Cost-effective, Excellent X-ray resistance | Higher resolution than GOS |
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| Deposition Type | Direct deposition | Indirect deposition | ||||||||
| Substrate | Glass-Free | Glass | Flexible | Metal | ||||||
| CsI:Tl Thickness(ใ) | 300 | 500 | 300 | 500 | 300 | 500 | 300 | 500 | ||
| Sensor Type | a-Si TFT | TFT | ||||||||
| IGZO TFT | CMOS | |||||||||
| MTF(%) @ 2lp/mm | ๋ฐ์ดํฐ ํ์ | ๋ฐ์ดํฐ ํ์ | ||||||||
| Sensitivity(lsb/uGy) | ||||||||||
| Light Out(%) @ Lanex sheet | ||||||||||
| Effective Dim.(Max.) | ๋ฐ์ดํฐ ํ์ | ๋ฐ์ดํฐ ํ์ | ||||||||
